Filtronic highlights the challenges of next-generation connectivity
Updated: 5 days ago
As satellite constellations expand and demand grows across telecommunications, defence and space, communications systems are moving into higher-frequency millimetre-wave spectrum.
In a new article for Electronics Weekly, Dr Tudor Williams, Chief Technology Officer at NETPark-headquartered Filtronic, explains why this shift requires a different approach to the design and manufacture of communications technology.
At frequencies above 30GHz, even small imperfections in connectors, packaging and signal paths can create significant losses. Technologies that perform reliably at lower frequencies may therefore be unable to deliver the power, efficiency and signal quality required by advanced systems.
The article explains how waveguides can provide an efficient, low-loss alternative to conventional circuit-board traces and coaxial cables. It also examines the roles of gallium arsenide, gallium nitride and indium phosphide semiconductors in meeting different power, efficiency and low-noise requirements.
Thermal management, mechanical design and radio-frequency performance must all be considered together. Manufacturing precision is equally important, as a design that performs well in simulation must also be produced consistently at scale.
Filtronic has almost 50 years of experience in high-frequency design, packaging, manufacturing and testing. From its headquarters and manufacturing base at NETPark, the company develops technology for demanding space, defence and telecommunications applications.
The article demonstrates the specialist radio-frequency, semiconductor and advanced-manufacturing capability based at NETPark – and its importance to the next generation of global communications.
