Filtronic completes multi-year GaN packaging project

Filtronic completes multi-year GaN packaging project

Filtronic has successfully completed a multi-year project to develop novel plastic QFN packaging for Gallium Nitride (GaN) devices, marking a significant milestone for UK sovereign capability in advanced semiconductor technology.

The project was part-funded through the Defence and Security Accelerator (DASA), part of UK Defence Innovation, via its Defence Technology Exploitation Programme (DTEP). Supported by a major defence prime contractor, the project was completed in August 2025.

The programme saw Filtronic design, manufacture and qualify QFNs incorporating GaN-based MMICs, this included the procurement and commissioning of a QFN production line to enhance vertical integration.

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